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Side Fed Die

COMPUPLAST® SOFTWARE / Product  / VEL™ Modules / Side Fed Die

VEL™ Side Fed Die Module™: Precision Design for Pipe and Cable Coating

The COMPUPLAST® VEL™, Side Fed Die module™  is used for the analysis and design of all types of side fed dies or cross-head dies that are typically used in pipe and cable coating or blow molding industry.

Using either a Control Volume Method (CVM) of mathematical analysis, or a fully 3D Finite Element Method (FEM), this module can provide the user with an accurate prediction of the expected die performance.

The user-friendly, intuitive interface and CVM solution technique allows the user to optimize designs quickly and easily.

VEL™ Flat Spiral Die Module™: Essential for Blown Film Extrusion Design

The VEL™, Side Fed Die module has been developed with the extrusion process engineer in mind.

Many world class extrusion die manufacturers use the VEL™ Side Fed Die module as a part of their daily design procedures.

Many processors and technical service personnel use this module to study and analyze the effect of resin changes on their process.

The VEL™, Flat Spiral Die module™ Features Summary:

  • Intuitive user-friendly graphical interface
  • Fast and easy parametric geometry definition
  • Material degradation elimination
  • Optical defects elimination
  • Optical defects elimination
  • Residence time analysis
  • Special automatic design optimization
  • Fast, efficient solvers
  • Includes fast CV solvers and also full 3D FEM solver
  • Custom report configuration
  • HTML report
  • Ability to export the results into Excel file
  • Powerful post processing

Ready to Enhance Your Extrusion Process?

Tell us more about your project or software needs, and our experts will get in touch with a tailored solution.